Precision Diamond Grinding Paste

The paste’s precision lies in its strictly controlled diamond particle size and distribution—a critical factor for achieving high-precision surface finishes:​ 
Narrow Grit Tolerance: Unlike standard pastes with wide particle size variation, our diamond grits are graded to a tolerance of ±0.1μm. For example, the 1μm grit paste contains only particles between 0.9μm-1.1μm, ensuring uniform abrasion that avoids over-grinding or leaving micro-scratches. This is essential for applications like optical lens polishing (requiring surface roughness Ra ≤0.02μm) or semiconductor wafer thinning (needing thickness variation ≤5μm).​ 
High Diamond Concentration: Dense, evenly dispersed diamond particles (Mohs 10) provide consistent cutting power across the paste’s application area. Higher concentration variants are ideal for heavy-duty precision grinding (e.g., carbide mold cavity finishing), while lower concentration (40%-50%) options suit fine polishing (e.g., medical device stainless steel components). The concentration stability ensures every gram of paste delivers the same grinding efficiency, critical for batch processing consistency.​ 
Sharp Diamond Crystal Shape: Selected for octahedral crystal structures, the diamond particles retain sharp cutting edges during use—even on ultra-hard materials like sapphire (Mohs 9), tungsten carbide (Mohs 8.5), or silicon carbide. This sharpness reduces grinding cycles by 30%-50% compared to synthetic abrasive pastes, while minimizing heat generation (a major cause of surface deformation in precision parts).