High Concentration Diamond Grinding Paste

Tired of grinding pastes that lack cutting power, leave uneven finishes, or run out fast on ultra-hard materials? Our High Concentration Diamond Grinding Paste solves these pain points—formulated with 50-70% high-purity diamond particles (far exceeding the 30-40% concentration of standard pastes), it delivers exceptional grinding efficiency and precision for professionals in semiconductor manufacturing, jewelry making, optical lens processing, and mold polishing.​

The paste’s core advantage lies in its high diamond concentration—dense, evenly distributed diamond particles (Mohs 10) create three game-changing benefits:​
Faster Material Removal: More diamond particles per gram mean quicker grinding of ultra-hard materials. It cuts through sapphire, carbide, quartz, and hardened steel (HRC 60+) 2-3x faster than low-concentration pastes, reducing processing time for high-precision parts.​
Longer Service Life: The high particle density resists “wear-out” — a single 50g jar polishes up to 100+ optical lenses or 50+ carbide mold components, vs. 30-40 pieces with standard pastes. This lowers long-term material costs for high-volume production.​
Uniform Finish: Dense diamond particles ensure consistent contact with the workpiece surface, eliminating “spotty” polishing or scratch marks. Critical for applications like semiconductor wafers or gemstone facets, where surface flatness and smoothness directly impact product quality.